MediaTek Chairman Wins IEEE's Highest Personal Honor, Dimensity Dual-Core Leads New Large-Scale AI Era

Recently, the International Institute of Electrical and Electronics Engineers (IEEE) decided to award the Robert N. Noyce Medal, one of the highest personal honors in the electronics industry, to MediaTek Chairman Cai Mingjie. It hereby commends Mr. Cai Mingjie for his achievements. His vision and influence on the global semiconductor industry have given billions of people around the world access to advanced technology and the benefits it brings.

Cai Mingjie said that for decades, he has witnessed the huge impact of small transistors on human life. At MediaTek, he is fortunate to be able to drive innovation so that billions of people around the world can benefit from the benefits of technology, and inspire the next generation of engineers to continue to contribute their intelligence and technological capabilities to improve the world

Mr. Cai Mingjie’s philosophy is also reflected in the development of MediaTek. In recent years, MediaTek has been bringing new changes to the lives of the public through many new technologies and new products.

MediaTek has played an important role in promoting the popularity of 5G networks around the world. The company's Dimensity 5G series chips have become the first choice from high-end flagship to mainstream markets with their excellent performance, energy efficiency and AI performance, ranking first in the global mobile SoC market for three consecutive years (12 months)

Among them, the recently released Dimensity 9300 has epoch-making performance and generative AI computing power advantages with its full large-core architecture. Morgan Stanley analysts Charlie Chan and Daisy Dai praised the Dimensity 9300 in the report, calling it the most powerful smartphone SoC currently on the market and a good choice for most Android flagship manufacturers.

Focusing on the currently hot generative AI, MediaTek has successively launched two products, Dimensity 9300 and Dimensity 8300. With tens of billions of large model computing power, it will promote the implementation of generative AI on mobile phones. These two chips were launched on the vivo X100 series and Xiaomi Redmi K70E respectively, opening a new era of mobile phone AI large model applications.

In addition to the leading large-scale performance of device-side AI on Dimensity 9300 and Dimensity 8300, MediaTek is also actively investing in the ecological construction of "hybrid AI computing" for device-cloud collaboration, and is committed to building full scenarios Smart new experience. In the second half of this year, MediaTek announced that it would jointly launch a hardware ecological co-creation plan for Feipiao and Wenxin large models with Baidu. The two parties will jointly promote the adaptation of MediaTek hardware platforms to Feipiao and Wenxin large models.

It is not only the mobile phone product line that we are familiar with. Based on its leading advantages in 5G, wireless connection, AI and other technologies, MediaTek is also constantly accelerating the advancement of comprehensive intelligence in various fields, such as satellite communications, smart travel, and smart homes. With leading innovative products and technologies.

Especially this year, MediaTek released the Dimensity Auto automotive platform for the automotive field, which includes Dimensity Auto smart cockpit, Dimensity Auto Internet of Vehicles, Dimensity Auto smart driving, Dimensity Auto key components, etc., providing comprehensive solutions for software-defined cars. AI smart cockpit solutions will help the automotive industry achieve comprehensive innovation in technology and products

Under the leadership of Mr. Cai Mingjie, MediaTek is making in-depth changes in technology, products, industry and experience. With Dimensity 9300 and Dimensity 8300, MediaTek has opened the era of full-core AI, focusing on the full-scenario technology layout. Build a “full-scenario intelligent new experience” for users.

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