vivo X100 series upgraded again: first equipped with Dimensity 9300 chip and V3 chip

According to news on October 19, in the first half of this year, MediaTek successfully launched its powerful Dimensity 9200 mobile platform. After being adopted by many models, it quickly became the performance leader in the Android camp. However, MediaTek officially announced the arrival of the Dimensity 9300 flagship chip early, which heralds greater performance and energy efficiency. Now, we have learned that MediaTek officials and some digital bloggers have released more in-depth information about this chip.

According to the latest official news from MediaTek, MediaTek and vivo have launched in-depth cooperation in the field of AI, taking the lead in realizing a 7 billion parameter AI large language model and running on the mobile phone side. The 1 billion parameter AI visual model creates an innovative experience in end-side generative AI (AIGC) applications and leads the industry. Digital blogger @digitalchatstation also pointed out that MediaTek Dimensity 9300’s CPU, GPU and AI AnTuTu benchmarks all surpassed Qualcomm Snapdragon 8 Gen3. Combined with previous exposures, the Dimensity 9300 is manufactured using TSMC’s N4P process and will adopt a full-core design for the first time, consisting of 4 ultra-large core Cortex-X4 and 4 large-core Cortex-A720. Compared with competing Qualcomm Snapdragon 8 Gen3, MediaTek Dimensity 9300 has 3 extra large cores, and its overall performance is about 10% higher, making it the most powerful 5G chip in the Android camp.

On the other hand, according to previous exposures, the new vivo The X100 series continues the design concept of the previous model and uses a circular camera module. However, this time the design adjusts the circular module from the left layout to a centrally symmetrical layout, making the overall appearance more harmonious. In terms of hardware, vivo The X100 series will use the Dimensity 9300 mobile platform for the first time, and will also debut the V3 chip developed by vivo. Compared with the previous generation V2 chip, the overall performance has been significantly improved. The Pro version will also use a Vario-Apo-Sonnar telephoto lens for the first time, equipped with an OV64B sensor, providing a 64-megapixel resolution, a 1/2-inch outsole, a single pixel size of 0.7μm, and excellent zoom capabilities.

It is reported that the new vivo The X100 series will be equipped with the Dimensity 9300 flagship chip for the first time, and it is also claimed to be the industry's first flagship mobile phone to implement satellite communications on the Dimensity platform. Let’s wait and see for more details.

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