It is reported that TSMC is focusing on increasing 3nm production capacity this year and aims to achieve 80% utilization by the end of the year.

Taiwanese media "Economic Daily" reported that TSMC plans to fully expand its 3nm process production capacity this year, and it is expected that the utilization rate of this process will increase to 80% by the end of the year.

TSMC’s 3nm process technology has won orders from major manufacturers such as Apple, Qualcomm, and MediaTek. The industry expectsTSMC will also transfer part of its 5nm production capacity to this node to meet customer needs, which means TSMC has completely defeated competing companies such as Samsung and Intel in the 3nm process for generations.

Looking to the future 2nm process generation, TSMC is expected to provide related wafer foundry services starting in 2025, involving a total of at least five factories.

TSMC President Wei Zhejia recently revealed at the financial report conference that only one of the world's major manufacturers is not a 2-nanometer process customer of TSMC. Some people speculate that this customer may be Samsung Electronics, but overall, TSMC still occupies a leading position in the 2nm process field.

As a competitor, Samsung plans to launch the 2nm process in 2025. According to reports, Samsung has received 2nm orders from Japanese startup Preferred Networks, and has recently been actively cooperating with Meta to become its foundry.

As for Intel, its 18A process for external foundries will achieve mass production by the end of this year.

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