Huawei obtains new patent, pushing wafer processing technology to new heights

According to the list published by the State Intellectual Property Office, Huawei successfully obtained a new technology patent on December 12. This patent will significantly improve the alignment efficiency and accuracy of wafer processing

This patent is an important patent on a wafer processing device and wafer processing method. Its public number is CN117219552A, and the application date is June 2022. The following is an abstract of the patent:

This patent relates to a wafer processing device and a wafer processing method. The wafer processing device includes the following key components:

The wafer stage has a rotation function and can rotate along an axis

The robotic arm is composed of a manipulator, and its main responsibility is to The wafer is moved and accurately placed on the wafer stage

3. Controller and calibration assembly, the calibration assembly includes a grating plate that is fixed in a position relative to the wafer stage. In addition, a light source is included, which is also fixed relative to the grating plate. There is also an imaging element, which is fixed on the robotic arm and has the ability to receive the light emitted by the light source and transmit the light through the grating plate.

The working principle of the controller is based on the detection of received light by the imaging element, and then by controlling the mechanical arm or robotic arm Adjust the precise position of the wafer using the adjustment device

When the wafer stage carries the wafer, the grating plate and Imaging elements are located on both sides of the upper surface of the wafer stage, and this upper surface is used to support and fix the wafer. After rewriting: On the wafer stage carrying the wafer, the grating plate and imaging element are located on both sides of the upper surface of the stage. The upper surface of the stage is used to support and fix the wafer

The device and method provided by this patent will significantly improve the alignment efficiency and alignment accuracy of wafer processing, which will have a great impact on semiconductor manufacturing and other fields Significant impact.

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