The world's first unmanned semiconductor packaging production line was unveiled, and Samsung announced the successful automation

News from this site on September 4th. Unlike wafer manufacturing, the semiconductor packaging process requires a large amount of human resource investment. This is because the front-end process only requires moving the wafer, but packaging requires moving multiple components, such as the substrate and the tray containing the product.

Prior to this, packaging processing equipment basically required a lot of labor, but Samsung Electronics has achieved complete automation through equipment such as wafer transfer equipment (OHT), elevators and conveyor belts that move items up and down.

Samsung Electronics TSP (Test and System Packaging) General Manager Kim Hee-yeol announced at the "2023 New Generation Semiconductor Packaging Equipment and Materials Innovation Strategy Forum" that the company has successfully built the world's largest The first unmanned semiconductor packaging factory.

According to reports, this automated production line is located in Samsung Electronics' packaging factories in Cheonan City and Wenyang City. It has been built since June 2023. This production line can reduce its manufacturing-related labor force by 85%, and the equipment The failure rate is reduced by 90% and the efficiency is more than doubled.

Inquiries on this site found that the proportion of unmanned production lines only accounts for about 20% of the current Samsung packaging production lines. , but Samsung has also set a goal of transforming its packaging factories into fully unmanned production by 2030.

Kim Hee-yeol said, "By minimizing shift work, engineers can now take on more valuable work," "This will also help improve employees' health and quality of life." "We will achieve 'Smart packaging factory', based on hardware and software automation, provides customers with high-quality, lowest-cost products in a timely manner."

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