SoC reduced by 3℃! Redmi K70 Extreme Edition cooling amplification trick Wang Teng calls genius design

According to news on July 10, the Redmi K70 Extreme Edition will be released in July. Today, Redmi officially started to warm up the new machine. In order to fully unleash the performance of the Dimensity 9300+, the Redmi K70 Extreme Edition will adopt the industry’s new generation of heat dissipation technology, claiming to be “the strongest heat dissipation design in Xiaomi’s history.”

Redmi K70 Extreme Edition is equipped with a new 3D ice cooling system. Through an innovative concave and convex platform design, the convex surface is closer to the processor, which reduces the SoC core temperature by up to 3°C compared to the previous generation. The concave surface is far away from the screen, resulting in a lower screen temperature sensation. Wang Teng, general manager of the fenye Redmi brand, said: "We have achieved a 0.65mm concave and convex platform on a stainless steel circulating cold pump with a thickness of only 0.35mm, which requires extremely high manufacturing process. It is definitely a genius design!"

1. The Redmi K70 Extreme Edition is the most perfect product of Redmi to date. It is known as the "Performance Demon" and has an AnTuTu score of over 2.38 million points.

2. This machine will challenge three firsts in terms of gaming experience:

   • No.1 in performance scores
   • No.1 in frame rate/energy efficiency in the same game
   • Original/Tie’s self-developed super frame and super sub-concurrency, No. 1 in duration One

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