It is reported that the Xiaomi Mi 15 Pro engineering machine adopts a new module with a round and square design, and a 50Mp ultra-large bottom main camera

Thanks to netizen Xinghen Yongzhi for submitting clues! According to news on May 13, blogger @digitalchatstation today brought the latest news about Xiaomi’s “Big Cup” engineering machine, which is expected to come from Xiaomi 15 Pro.

According to the blogger, this engineering machine is equipped with a square Deco in the upper left corner. The flash is moved outside the Deco. The current image display is 50Mp ultra-large bottom main camera + 50Mp ultra-wide angle + 50Mp periscope telephoto. , a new module with a round and square design, not a JN1 sensor. According to the current very early prototype feedback, this new phone will also be equipped with a 2K new substrate full depth micro-curved screen, and the screen size will not change much. In addition, the machine is equipped with a 50MP ultra-large bottom three-camera solution, one of which is a periscope telephoto with telephoto macro and a full-range ultra-large aperture solution. For comparison, Xiaomi 14 Pro is equipped with Snapdragon 8 Gen 3 processor, equipped with a 6.73-inch 2KAMOLED full-depth micro-curved screen, peak brightness Up to 3000nit, the body has a built-in 4880mAh battery, and supports 120W Xiaomi ThePaper wired second charging/50W Xiaomi ThePaper wireless second charging/wireless reverse charging. In terms of imaging, Xiaomi Mi 14 Pro is equipped with a 50MP Leica super dynamic main camera (Light and Shadow Hunter 900 custom image sensor), a Leica 75mm floating telephoto, a 50MP Leica ultra-wide angle, and a front-facing 32MP high-definition camera. According to information disclosed by Qualcomm, the 2024 Snapdragon Summit will be held in October, when the company will release its flagship product Snapdragon 8 Gen 4 SoC. As for when the new Xiaomi 15 series will be launched, we will keep an eye on it.

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