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According to news from this site on August 22, Intel is actively investing in advanced process research and development, and is also simultaneously strengthening its advanced packaging business. It is currently building the latest packaging factory in Penang, Malaysia, and strengthening its 2.5D/3D packaging layout.
The company said it plans to quadruple its 3D Foveros packaging production capacity by 2025. Intel Vice President Robin Martin revealed in an interview in Penang today that the new Penang factory will become the company's largest 3D advanced packaging base in the future.
In 2021, Intel announced that it will invest US$7.1 billion (note on this site: currently approximately 51.759 billion yuan) to build a new leading semiconductor packaging factory operated by Intel in Bayan Lepas, Penang.
According to Intel, the chip’s packaging serves as the physical interface between the processor and the motherboard and plays a critical role in product-level performance. role. Advanced packaging technology can facilitate the integration of multi-process technology by various computing engines and help adopt new methods in system architecture
According to reports, Intel’s Foveros packaging technology uses 3D stacks to achieve logical pairing. The integration of logic provides designers with great flexibility to mix and match technology IP blocks with various memory and input/output elements in new device form factors. Products can be divided into smaller chiplets or tiles, with I/O, SRAM and power delivery circuitry fabricated in the base chip, and high-performance logic chiplets or tiles stacked on top. In addition, Intel's new packaging capabilities are unlocking new designs by combining EMIB and Foveros technologies, allowing different chiplets and blocks to be interconnected with performance essentially equivalent to a single chip. With Foveros Omni, Intel says designers can gain greater communication flexibility by leveraging small chips or blocks within a package.
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