News from this site on March 4, according to Korean media DealSite, SK Hynix and Samsung Electronics will significantly expand production of HBM memory this year. However, HBM memory has problems such as low yield, making it difficult to keep up with the demand related to the AI market.
As a hot commodity in the AI semiconductor market, HBM memory adopts wafer-level packaging (WLP): multi-layer DRAM memory wafers are connected to the basic wafer through TSV through silicon holes, One of the layers Problems with DRAM mean the scrapping of the entire HBM stack.
Taking an 8-layer stacked product as an example, if the yield of each stack is 90%, then the yield of the overall HBM stack is only 43%, and more than half of the DRAM is discarded. When HBM enters 12-layer or even 16-layer stacking, the yield will be further reduced.
DealSite stated that the current overall yield rate of HBM memory is around 65%, which is significantly lower than traditional memory products, and due to the nature of WLP, the yield rate is difficult to reach 80% or even 90%.
On the other hand, SK Hynix and Samsung, two dominant manufacturers of HBM memory, have significantly expanded their production capacity this year.
According to estimates from Korean securities firm Kiwoom Securities, Samsung Electronics’ HBM memory monthly production capacity is expected to increase from 25,000 wafers in the second quarter of last year to 150,000 to 170,000 wafers in the fourth quarter of this year; during the same period , SK Hynix's monthly production capacity is expected to jump from 35,000 pieces to 120,000 to 140,000 pieces.
However, relative to the AI market’s demand for HBM memory, the production capacity increases of SK Hynix and Samsung are still insufficient: According to a recent report on this site, SK Hynix executives once again confirmed that this year’s HBM production capacity quota has been sold out; according to another Korean media NEWSIS reported late last year that Samsung had already completed negotiations with major customers on production capacity this year.
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