News from this site on October 13, according to Hebi Daily, on the afternoon of October 12, the commissioning ceremony of the Loongson Zhongke chip packaging base project was held in Hebi Science and Technology Innovation City. Loongson Zhongke's chip packaging base is located in Baijia Intelligent Manufacturing Industrial Park in Hebi Science and Technology Innovation City. is Loongson Zhongke's first chip packaging project deployed nationwide.
In April this year, the first phase of the project officially started construction. A thousand-level clean factory covering an area of 402 square meters and a clean factory covering an area of 226 square meters will be built. A 10,000-square-meter clean factory building and a 92-square-meter constant temperature and humidity warehouse
According to the person in charge of Loongson Zhongke Technology Co., Ltd., the project has initially developed the bonding and packaging capabilities of Loongson One No. 1 chip packaging, testing, packaging and shipping capabilities, and accelerate the construction of the Loongson No. 1 series of chips, as well as the packaging and testing capabilities of the power/clock chip series. The next step will be to gradually accumulate experience and reserve talents, and strive to build a national chip packaging system.
This site inquired about the official website of Loongson Zhongke and learned thatLoongson No. 1 is a product developed by Loongson Zhongke for embedded specialized applications. Currently, the official website lists three products:
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