AR devices usher in new breakthroughs: Samsung Display advances LEDoS technology research and development

According to news on July 13, Samsung Display is actively developing LEDoS (LED on silicon) technology for augmented reality (AR) devices. This technology is expected to achieve microLED chip sizes below the micron level.

It is understood that at the "Deep Tech Forum 2023" that Samsung Display recently participated in, Kim Gongmin, executive director of the technology strategy team of the company's R&D center Gong-min) made relevant remarks on LEDoS technology. Jin Gongmin pointed out that the Apple Vision currently launched by Apple on the market The Pro head display uses OLEDoS (OLED on silicon) technology, which is mainly based on organic light-emitting diodes (OLED) on a silicon substrate.

However, OLEDoS technology cannot meet the requirements of AR devices in terms of brightness, light shape, and product life, so it is difficult to be applied to augmented reality devices. To overcome this problem, Samsung Display is working on developing LEDoS technology by using light-emitting diodes (LEDs) to achieve smaller-sized LED chips to improve resolution, brightness and product life performance.

According to the editor’s understanding, Jin Gongmin mentioned that one of the challenges they are currently facing is the wafer technology on the backplane side. Although the size of microLED chips can be reduced through existing semiconductor processes, in the process of realizing ultra-high-resolution screens, completely different characteristics from LEDs for lighting will appear. When the size of LEDs shrinks to 20 microns or below, their performance is significantly reduced and the expected functions cannot be achieved. Therefore, how to solve this challenge to achieve the desired functionality remains a key question.

The research and development of LEDoS technology has brought new development prospects to augmented reality devices. By reducing the size of LED chips, this technology has the potential to improve resolution, brightness and product life, thereby opening up more opportunities for the advancement of AR technology. Some technical problems still need to be solved, especially regarding the wafer technology on the backplane side, to ensure the stability and reliability of LEDoS technology. We are full of expectations for future breakthroughs and innovations in augmented reality devices due to continuous improvements in technology.

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