What does cmp device mean?

cmp equipment is chemical mechanical planarization equipment; cmp is the abbreviation of "Chemical Mechanical Polishing". It is one of the key technologies for semiconductor wafer surface processing and is currently the most common semiconductor material surface planarization technology. Its work The process is that the polishing head presses the surface of the wafer to be polished against the rough polishing pad, and achieves global planarization with the help of polishing liquid corrosion, particle friction, polishing pad friction and other couplings.

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What does cmp equipment mean

CMP equipment, the full name of chemical mechanical planarization (CMP) equipment, is one of the key equipment for semiconductor wafer surface treatment and is currently the most common Semiconductor material surface planarization technology.

CMP stands for Chemical Mechanical Polishing, which is one of the key technologies for surface processing of semiconductor wafers. Chemical mechanical polishing technology is used many times in the manufacturing process of single crystal silicon wafers and in the first half of the process. Compared with the previously commonly used mechanical polishing, chemical mechanical polishing can make the surface of the silicon wafer flatter, and also has the advantages of low processing cost and simple processing method, so it has become the most common surface smoothing technology for semiconductor materials.

Since integrated circuit components currently generally use multi-layer three-dimensional wiring, the front-end process of integrated circuit manufacturing requires multi-layer circulation. During this process, the wafer surface needs to be planarized through the CMP process. Integrated circuit manufacturing is the main application scenario of CMP equipment, which is repeatedly used after film deposition and before photolithography.

CMP equipment is the only way to flatten the wafer. Its working process is: the polishing head presses the surface of the wafer to be polished against the rough polishing pad, and uses the polishing liquid corrosion, particle friction, and polishing pad to Friction and other couplings achieve global flattening. The polishing disk drives the polishing pad to rotate, and the advanced end point detection system rubs different materials and thicknesses to achieve real-time thickness measurement with a resolution of 3-10nm to prevent over-polishing. The more critical technology lies in the polishing head that can exert global zoned pressure. It can achieve ultra-precise and controllable unidirectional pressure on multiple annular areas around the wafer in a limited space, so that it can respond to the film thickness measured by the polishing disk. The data adjusts the pressure to control the polishing shape of the wafer, so that the polished wafer surface reaches ultra-high flatness and the surface roughness is less than 0.5nm, which is equivalent to one hundred thousandth of a human hair.

Unlike semiconductor equipment such as photolithography machines and etching machines, CMP equipment is less affected by Moore's Law and does not have a technology iteration cycle over a long period of time. Application There are no significant differences between 28nm and 14nm CMP devices, just optimization of specific module technologies. However, as the CMP process continues to advance from 14nm to 7nm, 5nm, and 3nm advanced processes, CMP technology will continue to develop in the direction of refined polishing head partitioning, intelligent process control, and multi-energy combination of cleaning units.

Patents are a blessing for forerunners and a "curse" for those who come after. After 2013, the number of CMP patent applications has grown slowly, while the number of post-CMP cleaning patent applications has been in decline. The overall number of global CMP patent applications remains stable, reflecting that there are currently no major technological innovations in global CMP technology, and latecomers must face strong patent barriers if they want to catch up.

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