1. Main frequency
The clock frequency inside the CPU is the working frequency of the CPU when performing operations. Generally speaking, the higher the main frequency, the more instructions are completed in one clock cycle, and the faster the CPU's computing speed. However, due to different internal structures, not all CPUs with the same clock frequency have the same performance.
2. FSB
is the system bus, the frequency at which the CPU and peripheral devices transmit data, specifically the bus speed between the CPU and the chipset.
3. Frequency multiplication
Originally there was no concept of frequency multiplication. The main frequency of the CPU and the speed of the system bus are the same. However, the speed of the CPU is getting faster and faster, and the frequency multiplication technology is also limited. Born in answer. It allows the system bus to operate at a relatively low frequency, and the CPU speed can be infinitely increased through frequency multiplication. Then the calculation method of CPU main frequency becomes: main frequency = FSB x multiplier. That is to say, the frequency multiplier refers to the multiple of the difference between the CPU and the system bus. When the external frequency remains unchanged, the frequency multiplier is increased, and the CPU main frequency will be higher. Intel CPU with K version can be overclocked by adjusting the multiplier and voltage.
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4. Cache
Most of the data information processed by the CPU is transferred from the memory However, the computing speed of the CPU is much faster than that of the memory. Therefore, a memory is placed during this transmission process to store the data and instructions frequently used by the CPU. This increases data transfer speed. It can be divided into first-level cache, second-level cache, and some also have third-level cache.
5. Level 1 cache
is L1 Cache. Integrated inside the CPU, it is used to temporarily save data while the CPU is processing data. Since cached instructions and data work at the same frequency as the CPU, the larger the capacity of the L1 cache, the more information can be stored, which can reduce the number of data exchanges between the CPU and the memory and improve the computing efficiency of the CPU. However, because the cache memory is composed of static RAM and has a complicated structure, the capacity of the L1 cache cannot be made too large in the limited CPU chip area.
6. Second level cache
is L2 Cache. Due to the limitation of L1 level cache capacity, in order to increase the computing speed of the CPU again, a high-speed memory, that is, the level 2 cache, is placed outside the CPU. The working frequency is relatively flexible and can be the same frequency as the CPU or different. When the CPU reads data, it first searches in L1, then L2, then the memory, and then the external memory. Therefore, the impact of L2 on the system cannot be ignored.
7. Level 3 cache
The level 3 cache is a cache designed for data that misses after reading the level 2 cache. Among CPUs with level 3 cache, only about 5 % of the data needs to be called from memory, which further improves CPU efficiency. The principle of operation is to use a faster storage device to retain a copy of the data read from the slower storage device. When it is necessary to read and write data from the slower storage device, the cache can enable the read and write data to be read from the slower storage device. The writing action is completed on the fast device first, which will make the system response faster.
8, TDP
The maximum power used by the CPU when fully loaded.
9. Manufacturing process
The manufacturing process of the CPU refers to the width of the connection lines of the internal components when producing the CPU on silicon material. In the past, it was generally expressed in microns, but now it is mostly expressed in nanometers. , the smaller the value, the more advanced the manufacturing process, the higher the frequency the CPU can reach, the lower the power consumption, and the more transistors can be integrated. Intel's current manufacturing process is 14nm, and AMD's manufacturing process is 28nm.
Simply speaking, for products of the same platform, the larger the main frequency and cache, the better. Power consumption is proportional to the heat generated. Generally speaking, the higher the TDP of the CPU, the more expensive the heat sink required.
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