Inspur Information and Intel jointly release the world's first fully liquid-cooled cold plate server reference design

News from this site on January 19. According to official news from Inspur Server, on January 18, Inspur Information and Intel jointly released the world’s first fully liquid-cooled cold plate server reference design, and it was open to the industry , to promote the large-scale deployment and application of all-liquid cooling cold plate solutions in global data centers.

Based on this reference design, Inspur Information launched a fully liquid-cooled cold plate server, which claims to achieve nearly 100% liquid cooling of server components and achieve a PUE value close to the 1 level.

Note on this site: PUE is the abbreviation of Power Usage Effectiveness. The calculation formula is "total energy consumption of data center / energy consumption of IT equipment", where the total energy consumption of data center includes IT equipment energy consumption, cooling and power distribution. When considering the energy consumption of the system, the closer the PUE is to 1, the less energy the non-IT equipment consumes, that is, the higher the energy efficiency level.

The all-liquid cold plate server launched by Inspur Information realizes the cooling of the main heating components of the server such as CPU, high-power memory, NVMe hard drive, OCP network card, power supply, PCIe adapter card and optical module. The board is fully covered with liquid cooling, PUE is reduced to below 1.05, and more than 30% of the data center space is saved through "de-air conditioning".

At the same time, this product has designed many system component-level liquid cooling solutions based on the differentiated needs of different components such as structure, material, and operating temperature, including PSU, memory, Hard disk, expansion module, etc. Users can choose as needed.

Inspur Information stated that the first memory sleeper radiator liquid cooling solution combines the advantages of traditional air cooling and cold plate heat dissipation. It is easier to assemble and install than the existing pipe (Tubing) memory liquid cooling solution. maintenance and greater versatility.

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