CES 2024 preview: Cooler Master releases powerful V8 3DVC radiator, with improved heat dissipation effect

According to news on January 6, Cooler Master announced today that it will launch a new radiator-V8 3DVC, and plans to publicly display it at CES 2024 next week.

New V8 The 3DVC radiator is an important upgrade based on the original V8 series. This product combines innovative vapor chamber technology and superconducting heat pipe technology to greatly improve heat dissipation efficiency. At the same time, it is also equipped with two Mobius fans with a diameter of 120mm, ensuring that during high-performance operation, the heat of the CPU can be effectively taken away and the stable operation of the hardware can be maintained. According to official data, this radiator has a heat dissipation capacity of up to 300W.

According to the editor’s understanding, Cooler Master’s response to the new V8 The design of 3DVC radiator is very careful. Its redesigned vapor chamber enables more even heat transfer and avoids hot spots. At the same time, the application of superconducting composite heat pipe technology almost doubles the maximum heat transfer amount, thus ensuring maximum heat transfer efficiency. Additionally, the radiator features a stylish and functional design that not only looks great, but also coordinates well with other components within the case. Efficient heat transfer and heat dissipation design ensures that the CPU remains within the optimal operating temperature range even under heavy load operation.

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