According to news on October 24, MediaTek is about to release its latest flagship chip - Dimensity 9300. After this news was exposed, industry chain sources revealed that the chip has taken the lead in completing the adaptation and adjustment with vivo’s self-developed imaging chip V3, and will make its debut in the vivo X100 series released next month.
This news was also confirmed by blogger @digitalchatstation. He said that the CPU, GPU, APU and ISP of the new phone will all perform well in terms of performance. Especially in terms of imaging, vivo X100 The Pro will be equipped with super outsole main camera, large aperture, new optical coating, dark-light periscope, ultra-telephoto macro and other functions, and is regarded as the leader among large models.
Previously, the vivo mobile phone model V2309A has appeared at the 3C certification center, supporting 120W fast charging up to 20V 6A, and is generally considered to be part of the X100 series.
According to known information, the first batch of vivo X100 series will launch two models, X100 and X100 Pro, equipped with MediaTek Dimensity 9300 mobile processing platform. And X100 The Pro will be released after the Spring Festival, equipped with Qualcomm Snapdragon 8 Gen 3 platform, providing users with more choices.
The above is the detailed content of MediaTek Dimensity 9300 chip is about to be released, and the vivo X100 series will be the first to carry it. For more information, please follow other related articles on the PHP Chinese website!