Micron D1β LPDDR5 16 Gb DRAM unveiled, bringing huge performance improvements to iPhone 15 Pro

News on September 27, iPhone 15 The Pro's internals have attracted a lot of attention. Recently, industry analysis organization TechInsights conducted a disassembly analysis, revealing the latest technology used inside this smartphone, especially Micron’s ultra-high-density D1β LPDDR5 16Gb Use of DRAM chips. This marks the industry's first foray into the D1β process. TechInsights pointed out that the pursuit of smaller, faster and more efficient components has always been a driving force in the technology industry, and D1β DRAM is known as one of the most advanced DRAM process nodes in the world.

TechInsights analysis results show that the iPhone 15 Pro is equipped with a DRAM chip model A3101, using Micron’s trend-setting D1β LPDDR5 16 Gb DRAM chip, code-named Y52P die. This chip is not only technically advanced, but also has a smaller physical size than its predecessor, the LPDDR5/5X D1α 16 Gb chips, their density increases significantly.

It is worth mentioning that Micron’s D1β Extreme ultraviolet lithography (EUVL) technology has been chosen to bypass the production of DRAM chips. EUVL technology is used by rival memory manufacturers such as Samsung and SK Hynix in DRAM manufacturing and is seen as an important driving factor in advancing DRAM processes to sub-15nm levels. However, Micron successfully developed and manufactured D1z, D1α, and now D1β DRAM chips without using EUVL technology, which far exceeded industry expectations.

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