SK Hynix releases big news: 238-layer 4D NAND flash memory is mass-produced, and mobile phone tests show that the speed is increased by 50%

News on June 8, South Korean memory manufacturer SK Hynix announced today that they have begun mass production of 238-layer 4D NAND flash memory chips. It is reported that SK Hynix is conducting product verification with overseas smartphone manufacturers.

SK hynix said that they have successfully developed client SSD (Client) suitable for smartphones and personal computers (PC). SSD) solution and began mass production in May. Whether in 176-layer or 238-layer products, SK hynix has ensured world-leading competitiveness in terms of cost, performance and quality. According to the editor's understanding, the 238-layer NAND flash memory chip is currently one of the smallest chips in the world. Compared with the previous generation of 176-layer chips, its production efficiency has increased by 34%. The data transmission speed of this new product reaches 2.4Gb (gigabit) per second, which is 50% faster than the previous generation, and the read and write performance has also been improved by about 20%.

SK Hynix said that after completing product verification with smartphone manufacturers, they will first supply 238-layer NAND flash memory to the mobile device market chips, and subsequently expanded their application scope to include PCIe-based 5.0 PC solid-state drive (SSD) and data center-level high-capacity SSD products.

SK Hynix introduced 4D technology in 2018, in which 96-layer NAND flash memory uses charge trapping technology (CTF) and PUC (Peri. Under Cell) technology. According to the editor's understanding, compared with 3D technology, 4D architecture has the advantages of smaller unit area and higher production efficiency. SK hynix expects these new products to play a positive role in promoting the company's performance in the second half of the year.

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