AMD 'Strix Halo” Zen 5 APU package exposure: RDNA 3.5 graphics die area 307 square millimeters

News from this site on August 1st. The source @7931doomer111 tweeted today (August 1st) and shared information about AMD “Strix Halo” Zen 5 APU, showing that the graphics die size equipped with RDNA 3.5 is 307 square millimeters. .

According to the exposed information, AMD “Strix Halo” Zen 5 APU adopts FP11 package with a package area of ​​37.5*45 mm, which is the same as the LGA-1700 slot panel.

The infographic shows that the largest Die is a graphics module, using RDNA 3.5 graphics technology, with an area of ​​at least 307 square millimeters, while the smaller Die has 2 CCDs (each providing 8 Zen 5 core), measuring 66.3 square millimeters.

Another exposed picture is attached to this site, which reveals the thermal design data of AMD “Strix Halo” Zen 5 APU, including 55W, 85W and 120W (excluding memory power consumption). AMD estimates memory power consumption at 9W for a 32GB system and 13W for a 128GB system.

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