It is reported that Nvidia once asked TSMC about the possibility of building an off-site CoWoS advanced packaging line, but was rejected

According to news from this site on July 23, Taiwanese media "Mirror Weekly" reported today that Nvidia CEO Jen-Hsun Huang visited partner TSMC when he led a delegation to Taiwan to attend the 2024 Taipei International Computer Show in June this year, seeking to strengthen CoWoS production capacity cooperation. AI computing GPUs based on NVIDIA Hopper, Blackwell and other architectures require 2.5D packaging to integrate with HBM memory. At present, TSMC is still Nvidia’s only 2.5D packaging mass production supplier with its mature CoWoS process.

2. TSMC executives responded on the spot, asking NVIDIA if it was willing to invest, and proposed setting up a wafer production line specifically for NVIDIA outside the factory.
3. This speech caused tension in the meeting, and the embarrassment was resolved only through the coordination of Wei Zhejia, chairman and president of TSMC.
4. Informed people believe that it is impossible for TSMC to build advanced packaging dedicated lines for NVIDIA outside the factory, but it is still possible to help NVIDIA build CoWoS dedicated lines within the factory.

5. Taiwanese media quoted anonymous people in the technology circle as saying that it was not unreasonable for TSMC to reject Nvidia’s proposal:

   • A separate production line outside the factory will bring about a series of management problems.
   • Secondly, if Nvidia agrees, major customers such as Apple, AMD and Qualcomm will also make similar requests, and the consequences will be out of control.
6. This site learned that TSMC has not provided dedicated production lines for major customers in the past, but only Apple has enjoyed this special treatment. At that time, TSMC was highly dependent on Apple orders to fill production capacity, but now TSMC's CoWoS production capacity is in a continued shortage.

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