Apple ranks second in the hot search! Ming-Chi Kuo says iPhone 17 won't use space-saving motherboard materials

According to news on July 18, today evening, the Weibo topic "iPhone 17 does not use space-saving motherboard materials" rushed to the second place in the hot search list. Analyst Ming-Chi Kuo published an article revealing that the 2025 iPhone 17 series will abandon the use of resin-coated copper foil (RCC) as the PCB motherboard material because it cannot meet Apple's high quality standards. Public information shows that resin-coated copper foil (RCC) is also called adhesive-backed copper foil. The product generally uses electrolytic copper foil. The resin is mainly epoxy resin, and a small amount of other high-performance special resins are also used.

1. The RCC process is to coat copper foil with high Tg thermosetting insulating resin. After baking, it is rolled up, slitted, and cut. Compared with traditional copper foil substrates, because RCC does not have glass cloth, it can Coating varnish directly on the copper foil not only simplifies the complexity of the process, but also greatly reduces the thickness of the electrolytic layer and the weight of the substrate.

2. The thickness of PCB using RCC is one-half thinner than traditional PCB. The terminal application is mainly in thin and light products such as mobile phones, computers, and cameras.
3. Unfortunately, the iPhone 17 series will not be coated with resin copper foil, mainly because it cannot pass Apple’s drop test.
4. It’s also worth mentioning that the A19 processor equipped with the iPhone 17 series has no access to TSMC’s 2nm process. Industry insiders say that TSMC’s 2nm will be ramped up as soon as the end of 2025. The iPhone 17 series simply cannot catch up, so the iPhone 18 series will take advantage of TSMC’s early adopters. 2nm process.

   

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