On June 22, blogger HMD_MEME'S released more detailed configuration information and renderings of the HMDFusion modular mobile phone.
![HMD Fusion 模块化手机配置泄露:高通 QCM6490、一亿像素、Pogo Pin 接口](https://img.php.cn/upload/article/000/000/000/171903448546668.png)
HMD Fusion configuration summary: SoC: Qualcomm QCM6490, based on 778G Screen: 6.6-inch FHD+ 120Hz LCD Camera: 108MP + 2MP, front-facing 16MP Memory: 8GB + 256GB Battery: 4800mAh, supports 30W charging Size : 164mm x 76mm x 8.6mm, weight 200gOthers: Wi-Fi 6E, 3.5mm headphone jack, power fingerprint 2-in-1, Pogo Pin expansion interface
![HMD Fusion 模块化手机配置泄露:高通 QCM6490、一亿像素、Pogo Pin 接口](https://img.php.cn/upload/article/000/000/000/171903448984303.jpg)
Noted that HMD will provide a variety of Pogo models for Fusion phones Mobile phone case with pin interface expansion capability.
![HMD Fusion 模块化手机配置泄露:高通 QCM6490、一亿像素、Pogo Pin 接口](https://img.php.cn/upload/article/000/000/000/171903449154859.jpg)
According to the development document information, among the 6 Pogo Pin metal contacts on the back of HMD Fusion, the first 5 are used to implement USB 2.0 support, and the latter one is used for ADC detection. Related reading: "Including Lumia "replica mobile phone"/Fusion modular model, HMD's new phone prices/more renderings exposed""HMD releases Fusion mobile phone development documents: back pogo pin contact support module Third-party accessories》
The above is the detailed content of HMD Fusion modular mobile phone configuration leaked: Qualcomm QCM6490, 100 million pixels, Pogo Pin interface. For more information, please follow other related articles on the PHP Chinese website!